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Rapidus Adds Chip Packaging Services to Plans for $32 Billion 2nm Fab

To say that the global foundry market is booming right now would be an understatement. Demand for leading-edge process technologies driven by AI and HPC applications is unprecedented, and with Intel joining the contract chipmaking game, this market segment is once again becoming rather competitive as well. Yet, this is exactly the market segment that…

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TSMC to Expand CoWoS Capacity by 60% Yearly Through 2026

Customer demand for AI and HPC processors is driving a much greater use of advanced packaging technologies, particularly TSMC’s chip-on-wafer-on-substrate (CoWoS) services. As things stand, TSMC is just barely meeting the current demand for this packaging method – never mind future demand – which is why last year the company announced plans to more than double CoWoS…

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Microsoft goes all-in on AI hardware with Copilot Plus PCs

During an AI-focused event at the company’s headquarters on Monday, Microsoft announced a new line of laptops called Copilot Plus PCs. In addition to introducing two of its own Copilot Plus PCs, Microsoft CEO Satya Nadella confirmed that its partners Acer, Asus, Dell, HP, Lenovo, and Samsung are all working on their own laptops with…

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Intel Teases Lunar Lake CPU Ahead of Computex: Most Power Efficient x86 Chip Yet

The next few weeks in the PC industry are going to come fast and furious. Between today and mid-June are multiple conferences and trade-shows, including Microsoft Build and the king of PC trade shows: Computex Taiwan. With all three PC CPU vendors set to present, there’s a lot going on, and a lot of product…

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Toshiba shows 32TB HDDs with heat-assisted and shingled drives

By Published: 20 May 2024 12:22 Toshiba has demoed 32TB (terabyte) and 31TB hard disk drives (HDD) that use heat- and microwave-assisted magnetic recording (HAMR and MAMR) plus shingled drive tracks to boost capacity over existing products by more than 40%. Currently, Toshiba’s largest capacity drive is a 22TB non-shingled MAMR model. Hard drive manufacturer…

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TSMC Readies Next-Gen HBM4 Base Dies, Built on 12nm and 5nm Nodes

Of the several major changes coming with HBM4 memory, one of the most immediate is the sheer width of the memory interface. With the fourth-generation memory standard moving from an already wide 1024-bit interface to a ultra-wide 2048-bit interface, HBM4 memory stacks won’t be business as usual; chip manufacturers are going to need to adopt…

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QStar launches tape access from anywhere with Global ArchiveSpace

Access to hundreds of tape drives in archives that scale to exabytes from anywhere in the world, with all data held in a single namespace. That’s what’s on offer from QStar, which launched its Global ArchiveSpace last month, aiming at access to infrequently accessed data for artificial intelligence (AI), high-performance computing (HPC) workloads and hyperscaler…

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Finland develops quantum algorithms for the future

Many experts believe that once quantum computers are big enough and reliable enough to solve useful problems, the most common deployment architecture will be to have them serve as accelerators for supercomputers. Several algorithms have already been developed to run on this architecture, including the most famous one – Shors algorithm, which will one day crack…

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Bristol goes live with UK AI supercomputer

The University of Bristol’s Islamabad-AI supercomputer is now online. Supported by £225m of government funding, the machine will be used by organisations such as the UK’s AI Safety Institute for AI research from this month. The funding, which is part of a £300m package to create a national Artificial Intelligence Research Resource (AIRR) for the…

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Apple M4 chip: everything we know so far about Apple’s new chip

Apple officially announced its latest silicon, the Apple M4, at its May ‘Let Loose’ event, the first time the company has announced a new chip in a tablet without first bringing it to its Mac desktops and laptops.We’ve got a good bit of detail on the Apple M4 thanks to the announcement as well as…

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