SK Hynix

TSMC Readies Next-Gen HBM4 Base Dies, Built on 12nm and 5nm Nodes

Of the several major changes coming with HBM4 memory, one of the most immediate is the sheer width of the memory interface. With the fourth-generation memory standard moving from an already wide 1024-bit interface to a ultra-wide 2048-bit interface, HBM4 memory stacks won’t be business as usual; chip manufacturers are going to need to adopt…

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SK Hynix Starts Mass Production of HBM3E: 9.2 GT/s

SK Hynix said that it had started volume production of its HBM3E memory and would supply it to a customer in late March. The South Korean company is the second DRAM producer to announce mass production of HBM3E, so the market of ultra-high-performance memory will have some competition, which is good for companies that plan…

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Micron Sells Out Entire HBM3E Supply for 2024, Most of 2025

Being the first company to ship HBM3E memory has its perks for Micron, as the company has revealed that is has managed to sell out the entire supply of its advanced high-bandwidth memory for 2024, while most of their 2025 production has been allocated, as well. Micron’s HBM3E memory (or how Micron alternatively calls it,…

Micron Sells Out Entire HBM3E Supply for 2024, Most of 2025 Read More »

GDDR7 Approaches: Samsung Lists GDDR7 Memory Chips on Its Product Catalog

Now that JEDEC has published specification of GDDR7 memory, memory manufacturers are beginning to announce their initial products. The first out of the gate for this generation is Samsung, which has has quietly added its GDDR7 products to its official product catalog. For now, Samsung lists two GDDR7 devices on its website: 16 Gbit chips…

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Micron Kicks Off Production of HBM3E Memory

Micron Technology on Monday said that it had initiated volume production of its HBM3E memory. The company’s HBM3E known good stack dies (KGSDs) will be used for Nvidia’s H200 compute GPU for artificial intelligence (AI) and high-performance computing (HPC) applications, which will ship in the second quarter of 2024. Micron has announced it is mass-producing 24 GB 8-Hi HBM3E devices with…

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ASML to Ship Multiple High-NA Tools in 2025, Expands Production Capacities

ASML began to ship its first High-NA lithography tool to Intel late last year ,and the machine will be fully assembled in Oregon in the coming months. Shipping only a single extreme ultraviolet (EUV) system with a 0.55 numerical aperture lens may not seem like too impressive, but the company aims to ship a much…

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Micron and SK hynix Ship LPDDR5-9600 Memory for Next-Gen Smartphones

Fast memory is crucial for the performance of high-end system-on-chips that are getting more sophisticated every year. When it comes to smartphones, the most obvious way to boost memory performance is to push its data transfer rate. Apparently, this is what Micron and SK Hynix are doing with their new LPDDR5X and LPDDR5T DRAMs that…

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Don’t wait to make that RAM upgrade – rumor suggests PC memory is going to get pricier soon

A fresh prediction of bigger price hikes for system RAM is somewhat worrying news for those who might be mulling an upgrade for the memory in their PC.Wccftech spotted a report from Taiwan Business Times, flagged up by MyDrivers, which observes that recent cuts in RAM production – by the major players Samsung, Micron, and…

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Western Digital to Split HDD and NAND Businesses

Western Digital has announced its decision to split its hard disk drive and NAND memory businesses, creating two separate public companies. According to the company, the change is aimed at refining the focus and operational efficiency of each business segment. The separation, planned to be tax-free, is slated for completion in the second half of…

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