HP

HP loses in US fraud case against Autonomy’s Mike Lynch

British tech entrepreneur and founder of Autonomy, Mike Lynch, has been acquitted of all charges, following a 12-week trial in San Francisco. The jury cleared Lynch of 15 counts of fraud and conspiracy that had been brought against him in relation to the 2011 Hewlett-Packard acquisition of Autonomy. HP has previously alleged that Lynch inflated…

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Mad Max production company gets Dell PowerScale to leverage generative AI

Australian media production house Kennedy Miller Mitchell (KMM), known for its work on action film Furiosa: A Mad Max Saga, has replaced its HPE storage and compute infrastructure with Dell hardware based around PowerScale NAS arrays. The move comes as it leverages generative artificial intelligence (GenAI) that allows it to pre-visualise movie scenes before they…

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HPE takes $4.5bn in enterprise IT AI server orders

Growth in the take-up of artificial intelligence (AI)-based systems was among the big wins for HPE as it announced its second-quarter financial results. The company posted Q2 revenue of $7.2bn, up 3%.  New AI servers are being delivered in as little as six weeks after the company fixes supply chain issues. In a blog discussing…

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Update on Intel’s Panther Lake at Computex 2024, Intel Powering Up Intel 18A Wafer Next Week

During the Intel keynote hosted by CEO Pat Gelsinger, he gave the world a glimpse into the Intel Client roadmap until 2026. Meteor Lake launched last year on that roadmap, and Lunar Lake, which we dived into yesterday as Intel disclosed technical details about the upcoming platform. Pat also presented a wafer on stage, Panther…

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Intel Unveils Lunar Lake Architecture: New P and E cores, Xe2-LPG Graphics, New NPU 4 Brings More AI Performance

Intel this morning is lifting the lid on some of the finer architectural and technical details about its upcoming Lunar Lake SoC – the chip that will be the next generation of Core Ultra mobile processors. Once again holding one of their increasingly regular Tech Tour events for media and analysts, Intel this time set up…

Intel Unveils Lunar Lake Architecture: New P and E cores, Xe2-LPG Graphics, New NPU 4 Brings More AI Performance Read More »

The AMD Computex 2024 Keynote Live Blog (6:30pm PT/01:30 UTC)

Computex keynote season is kicking into high gear this morning with the show’s leading keynote, which is being delivered by AMD. Company CEO Dr. Lisa Su will be presenting a keynote entitled “The future of high-performance computing in the AI era,” and with a run time of 90 minutes, we’re expecting AMD to have a…

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AMD Announces The Ryzen AI 300 Series For Mobile: Zen 5 With RDNA 3.5, and XDNA2 NPU With 50 TOPS

During AMD’s opening keynote at Computex 2024, company CEO Dr. Lisa Su revealed AMD’s latest AI PC-focused chip lineup for the mobile market, the Ryzen AI 300 series. Based on AMD’s new Zen 5 CPU microarchitecture, the Ryzen AI 300 series – codenamed Strix Point – is intended to offer an across-the-board improvement in mobile…

AMD Announces The Ryzen AI 300 Series For Mobile: Zen 5 With RDNA 3.5, and XDNA2 NPU With 50 TOPS Read More »

Qualcomm’s Computex 2024 keynote: powerful new chips, plus some jokes at Apple’s expense

I’m out in Taiwan at Computex 2024, and I’ve just finished watching Qualcomm’s major keynote presentation, led by CEO Cristiano Amon – somewhat comically dressed in a Snapdragon T-shirt and Windows Copilot-branded sneakers. Naturally, the keynote opened with a promo video – proudly labeled as ‘Shot on Snapdragon’, which is perhaps a cheeky dig at…

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The Qualcomm Computex 2024 Keynote Live Blog (10:30pm PT/05:30 UTC)

For our second keynote of the day for Computex, we have the 4th Musketeer of the great PC powers, Qualcomm. Slated to be the most PC-focused of the four keynotes, company CEO Cristiano Amon will be presenting a keynote entitled “The PC Reborn.” And while Amon is no stranger to giving keynotes, this is slated…

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TSMC’s 3D Stacked SoIC Packaging Making Quick Progress, Eyeing Ultra-Dense 3μm Pitch In 2027

TSMC’s 3D-stacked system-on-integrated chips (SoIC) advanced packaging technologies is set to evolve rapidly. In a presentation at the company’s recent technology symposium, TSMC outlined a roadmap that will take the technology from a current bump pitch of 9μm all the way down to a 3μm pitch by 2027, stacking together combinations of A16 and N2…

TSMC’s 3D Stacked SoIC Packaging Making Quick Progress, Eyeing Ultra-Dense 3μm Pitch In 2027 Read More »

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