Intel Invests $700 Million in Immersion Liquid Cooling Solutions

Intel Invests $700 Million in Immersion Liquid Cooling Solutions

Intel on Thursday said it would invest $700 million in its new research and development facility that will design next-generation immersion liquid cooling solutions and other data center-oriented technologies. In addition, the company rolled out the industry’s first open intellectual property (open IP) immersion liquid cooling solution and reference design that enables data centers to…

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TSMC to Start Risk Production Using 4nm Node in Q3

TSMC to Initiate 1.4nm Process Technology R&D

At processor manufacturers, fundamental and applied research and development work never stops, so now that Taiwan Semiconductor Manufacturing Co. has outlined a timeline for its N2 (2 nm-class) fabrication process that will enter high-volume manufacturing (HVM) in 2025, it is time for the company to start thinking about a succeeding node. If a new rumor…

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