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TSMC Posts Q1’24 Results: 3nm Revenue Share Drops Steeply, but HPC Share Rises

3 minutes of reading / AI, Apple, HP, iPhone, Taiwan Semiconductor Manufacturing, Tech / By

Taiwan Semiconductor Manufacturing Co. this week released its financial results for Q1 2024. Due to a rebound in demand for semiconductors, the company garned $18.87 billion in revenue for the quarter, which is up 12.9% year-over-year, but a decline of 3.8% quarter-over-quarter. The company says that in increase in demand for HPC processors (which includes…

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AMD Announces Ryzen Pro 8000 and Ryzen Pro 8040 Series CPUs: Commercial Desktop Gets AI

8 minutes of reading / AI, HP, Intel, Lenovo, Microsoft, Tech / By

AMD is looking to drive the AI PC market with options across multiple product lines, which aren’t limited to consumer processors. While primarily designed for the commercial sector, AMD has announced the Ryzen Pro 8000 ‘Phoenix’ series of APUs for desktops, which AMD claims is the first professional-grade CPU to include an NPU designed to provide…

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TSMC 2nm Update: N2 In 2025, N2P Loses Backside Power, and NanoFlex Brings Optimal Cells

3 minutes of reading / Flex, HP, Taiwan Semiconductor Manufacturing, Tech, Technology / By

Taiwan Semiconductor Manufacturing Co. provided several important updates about its upcoming process technologies at its North American Technology Symposium 2024. At a high level, TSMC’s 2 nm plans remain largely unchanged: the company is on track to start volume production of chips on it’s first-generation GAAFET N2 node in the second half of 2025, and N2P…

TSMC 2nm Update: N2 In 2025, N2P Loses Backside Power, and NanoFlex Brings Optimal Cells Read More »

TSMC’s System-on-Wafer Platform Goes 3D: CoW-SoW Stacks Up the Chips

2 minutes of reading / AI, HP, Tech, Technology, Tesla / By

TSMC has been offering its System-on-Wafer integration technology, InFO-SoW, since 2020. For now, only Cerebras and Tesla have developed wafer scale processor designs using it, as while they have fantastic performance and power efficiency, wafer-scale processors are extremely complex to develop and produce. But TSMC believes that not only will wafer-scale designs ramp up in…

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TSMC Jumps Into Silicon Photonics, Lays Out Roadmap For 12.8 Tbps COUPE On-Package Interconnect

2 minutes of reading / HP, Tech, Technology / By

Optical connectivity – and especially silicon photonics – is expected to become a crucial technology to enable connectivity for next-generation datacenters, particularly those designed HPC applications. With ever-increasing bandwidth requirements needed to keep up with (and keep scaling out) system performance, copper signaling alone won’t be enough to keep up. To that end, several companies are developing…

TSMC Jumps Into Silicon Photonics, Lays Out Roadmap For 12.8 Tbps COUPE On-Package Interconnect Read More »

TSMC Readies 8x Reticle Super Carrier Interposer For Next-Gen Chips Twice as Large As Today’s

3 minutes of reading / AI, HP, Tech, Technology / By

TSMC is no stranger to building big chips. Besides the ~800mm2 reticle limit of their normal logic processes, the company already produces even larger chips by fitting multiple dies on to a single silicon interposer, using their chip-on-wafer-on-substrate (CoWoS) technology. But even with current-gen CoWoS allowing for interposers up to 3.3x TSMC’s reticle limit, TSMC…

TSMC Readies 8x Reticle Super Carrier Interposer For Next-Gen Chips Twice as Large As Today’s Read More »

NVIDIA’s ‘cuLitho’ Computational Lithography Adopted By TSMC and Synopsys For Production Use

2 minutes of reading / AI, automation, HP, Synopsys, Tech / By

Last year, NVIDIA introduced its cuLitho software library, which promises to speed up photomask development by up to 40 times. Today, NVIDIA announced a partnership with TSMC and Synopsys to implement its computational lithography platform for production use, and use the company’s next-generation Blackwell GPUs for AI and HPC applications. The development of photomasks is a…

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SK Hynix Starts Mass Production of HBM3E: 9.2 GT/s

2 minutes of reading / AI, HP, SK Hynix, Tech / By

SK Hynix said that it had started volume production of its HBM3E memory and would supply it to a customer in late March. The South Korean company is the second DRAM producer to announce mass production of HBM3E, so the market of ultra-high-performance memory will have some competition, which is good for companies that plan…

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Ultra Ethernet Consortium Grows to 55 Members, Reveals Some Details on Upcoming HPC Backbone Tech

3 minutes of reading / AI, API, AWS, Baidu, Broadcom, Cisco, Dell, Google, HP, Huawei, IBM, Intel, Lenovo, Meta, Microsoft, Nokia, Tech, Tencent / By

The Ultra Ethernet Consortium (UEC) has announced this week that the next-generation interconnection consortium has grown to 55 members. And as the group works towards developing the initial version of their ultra-fast Ethernet standard, they have released some of the first technical details on the upcoming standard. Formed in the summer of 2023, the UEC aims…

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The DeepCool PX850G 850W PSU Review: Less Than Quiet, More Than Capable

5 minutes of reading / AI, compliance, HP, Tech / By

DeepCool is one of the few veterans in the PC power & cooling components field still active today. The Chinese company was first founded in 1996 and initially produced only coolers and cooling accessories, but quickly diversified into the PC Case and power supply unit (PSU) markets. To this day, DeepCool stays almost entirely focused…

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