TSMC’s 3D-stacked system-on-integrated chips (SoIC) advanced packaging technologies is set to evolve rapidly. In a presentation at the company’s recent technology symposium, TSMC outlined a roadmap that will take the technology from a current bump pitch of 9μm all the way down to a 3μm pitch by 2027, stacking together combinations of A16 and N2…
Microsoft has announced that DirectSR has been released, albeit in preview, but this is an important first step for a technology that promises to have major ramifications for PC gamers.Why? Because DirectSR is a big piece of the upscaling puzzle – whereby games can be made to run faster, by having them rendered at a…
Lexar has a long history of serving the flash-based consumer storage market in the form of SSDs, memory cards, and USB flash drives. After having started out as a Micron brand, the company was acquired in 2017 by Longsys which has diversified its product lineup with regular introduction of new products. Recently, the company announced…
Lexar ARMOR 700 Portable SSD Review: Power-Efficient 2 GBps in an IP66 Package Read More »
As the semiconductor industry continues to evolve, Arm stands at the forefront of innovation for its core and IP architecture, especially in the mobile space, by pushing the boundaries of technology to deliver cutting-edge solutions for end users. For 2024, Arm’s year-on-year strategic advancements focus on enhancing last year’s Armv9.2 architecture with a new twist. Arm has…
AMD is about to reveal its next-gen Zen 5 desktop CPUs, which are expected to be the Ryzen 9000 family, next week – and the processors should be on sale not long after that, if a leaker is correct.VideoCardz noticed that on Chiphell, leaker wjm47196 – a regular contributor to the grapevine, albeit a clunkily…
Intel has announced that it’ll hold its Innovation event late in September, and it’s likely that this will be where we see the revelation of Arrow Lake, Team Blue’s next-gen desktop chips.VideoCardz reports that Intel has told us the date to mark in our calendars for the annual event, with Innovation 2024 set to run…
Artificial intelligence (AI) on the personal computer (PC) was a central focus of the 2024 Consumer Electronics Show (CES) in Las Vegas earlier this year. PC and chip manufacturers such as AMD, Dell, HP, Lenovo, Intel and Nvidia announced AI PC innovations to come in the so-called “year of the AI PC”. Approximately 50 models…
Forrester: Preparing for the era of the AI PC Read More »
MSI on Thursday published the first image of a new desktop motherboard that supports the innovative DDR5 compression attached memory module (CAMM2). DDR5 CAMM2 modules are designed to improve upon the SO-DIMM form factor used for laptops, alleviating some of the high-speed signaling and capacity limitations of SO-DIMMs while also shaving down on the volume…
MSI Teases Z790 Project Zero Plus Motherboard With CAMM2 Memory Support Read More »
To say that the global foundry market is booming right now would be an understatement. Demand for leading-edge process technologies driven by AI and HPC applications is unprecedented, and with Intel joining the contract chipmaking game, this market segment is once again becoming rather competitive as well. Yet, this is exactly the market segment that…
Rapidus Adds Chip Packaging Services to Plans for $32 Billion 2nm Fab Read More »
AMD’s Strix Point processors are important for AMD – key, even, as they are laptop chips that’ll serve as the engine for Copilot+ PCs – but if the rumor mill is anything to go by, one thing Team Red can’t settle on is a name.This new leak on Strix Point comes from Golden Pig Upgrade,…
