TSMC’s 3D-stacked system-on-integrated chips (SoIC) advanced packaging technologies is set to evolve rapidly. In a presentation at the company’s recent technology symposium, TSMC outlined a roadmap that will take the technology from a current bump pitch of 9μm all the way down to a 3μm pitch by 2027, stacking together combinations of A16 and N2…
Blackpool Council is appealing to datacentre operators to support its bid to create a technology campus, dubbed Silicon Sands, to capitalise on the town’s close proximity to North Atlantic Loop undersea fibre cable network. The 40-acre Silicon Sands campus will be located within the Blackpool Airport Enterprise Zone, and will be populated by renewably powered…
File, block and object are fundamental to how users and applications access and modify data storage. That’s been the case for decades, and the transition to the cloud has seen that remain so, but with adaptations to the use case, performance and cost constraints of cloud storage. In this article, we look at the fundamentals…
Storage technology explained: File, block and object storage Read More »
Apple just launched its first tablet with OLED displays, the M4 iPad Pro, which comes in two sizes. That innovation will pave the way for the first MacBooks with OLED screens. The laptops have appeared in several reports in recent years. Some say the first MacBook Pros with OLED panels might launch in 2026. Others…
Apple’s first OLED MacBook Pro might not launch until the foldable MacBook is ready Read More »
Two separate sources with great track records at reporting Apple rumors said last week that a foldable MacBook is on track to launch at some point in 2026. The expensive device could hit stores even earlier than expected, possibly featuring a crease-free display and the M5 chip.The foldable MacBook would look just like a MacBook…
Foldable MacBook rumors make iPadOS 18 and macOS 15 even more exciting Read More »
When Michael Dell stepped onto the keynote stage at Dell Technologies World 2024 and said that the past 40 years of the organisation’s history were essentially the “pregame” for the world of artificial intelligence (AI), the people who helped him build the company from its humble beginnings into a global technology powerhouse could perhaps be…
Executive Interview: Why Dell wants to be your one-stop AI shop Read More »
Artificial intelligence (AI) on the personal computer (PC) was a central focus of the 2024 Consumer Electronics Show (CES) in Las Vegas earlier this year. PC and chip manufacturers such as AMD, Dell, HP, Lenovo, Intel and Nvidia announced AI PC innovations to come in the so-called “year of the AI PC”. Approximately 50 models…
Forrester: Preparing for the era of the AI PC Read More »
To say that the global foundry market is booming right now would be an understatement. Demand for leading-edge process technologies driven by AI and HPC applications is unprecedented, and with Intel joining the contract chipmaking game, this market segment is once again becoming rather competitive as well. Yet, this is exactly the market segment that…
Rapidus Adds Chip Packaging Services to Plans for $32 Billion 2nm Fab Read More »
Customer demand for AI and HPC processors is driving a much greater use of advanced packaging technologies, particularly TSMC’s chip-on-wafer-on-substrate (CoWoS) services. As things stand, TSMC is just barely meeting the current demand for this packaging method – never mind future demand – which is why last year the company announced plans to more than double CoWoS…
TSMC to Expand CoWoS Capacity by 60% Yearly Through 2026 Read More »
During an AI-focused event at the company’s headquarters on Monday, Microsoft announced a new line of laptops called Copilot Plus PCs. In addition to introducing two of its own Copilot Plus PCs, Microsoft CEO Satya Nadella confirmed that its partners Acer, Asus, Dell, HP, Lenovo, and Samsung are all working on their own laptops with…
Microsoft goes all-in on AI hardware with Copilot Plus PCs Read More »
