Under the CHIPS & Science Act, the U.S. government provided tens of billions of dollars in grants and loans to the world’s leading maker of chips, such as Intel, Samsung, and TSMC, which will significantly expand the country’s semiconductor production industry in the coming years. However, most chips are typically tested, assembled, and packaged in…
We’re entering Galaxy S25 rumors season now that the Galaxy Z Fold 6 and Flip 6 are out in stores. The next Samsung flagships are likely going to launch in early 2025, and the Ultra will be the best and most expensive version.It makes even more sense to see an uptick in Galaxy S25 rumors…
Imagine being in the same room as Google’s high-ranking Android execs discussing Apple’s WWDC announcements. Maybe they were following the live stream online to see what Apple Intelligence is all about and how it threatens Gemini.I bet Googlers were thrilled to see and hear that Apple Intelligence would not match the abilities of Gemini and…
The Pixel 9 is Google’s best weapon against Apple Intelligence Read More »
One of the core challenges that Rapidus will face when it kicks off volume production of chips on its 2nm-class process technology in 2027 is lining up customers. With Intel, Samsung, and TSMC all slated to offer their own 2nm-class nodes by that time, Rapidus will need some kind of advantage to attract customers away…
Rapidus Wants to Offer Fully Automated Packaging for 2nm Fab to Cut Chip Lead Times Read More »
A week after Western Digital confirmed that it had begun sampling of its 64 TB SSDs for datacenters, the company has teased its next-generation product, a 128 TB solid-state drive at FMS 2024. For now, all we know about Western Digital’s 128 TB SSD is that it uses the company’s BiCS8 QLC NAND memory and…
Western Digital Teases 128 TB Enterprise SSD: BiCS8 3D QLC for AI Workloads Read More »
Reports say that Apple wants to manufacture an ultra-thin iPhone next year and include it in the iPhone 17 series, replacing the Plus version. Dubbed the iPhone 17 Slim, Ultra, or Air, the device is reportedly part of Apple’s plan to create thinner devices that are in line with the M4 iPad Pro.I’ve already explained…
This is the tech that will make Apple’s ultra-thin iPhone 17 Slim possible Read More »
Solidigm’s datacenter SSD lineup includes models targeting different performance, endurance, and cost tradeoffs. Last year, the company had introduced the D5-P5336 QLC drive as a low-cost high-capacity drive for read-heavy workloads, while also preparing the SLC-based D7-P5810 for extremely write-intensive workloads requiring high endurance. The D7-P5520 / D7-P5620 Gen 4 drives with Solidigm’s own 144L…
Solidigm D7-PS1010 and D7-PS1030: PCIe 5.0 and 176L TLC Datacenter SSD Performance Play Read More »
Following Intel’s painful Q2 earnings call and the announcement of their 2025 cost reduction plan last week, it has become increasingly evident that Intel’s future is in the hands of their foundry group. Between Intel’s IDM 2.0 initiative and their internal chip production plans, all roads lead back to Intel retaking – and retaining –…
Intel 18A Status Update: First Chips Booting, First External Customer Tape-Out in H1’25 Read More »
Pixel fans are in for a big treat next week when Google unveils the Pixel 9 series. They’re not only getting the new Pixel hardware two months ahead of schedule, but they’ll also have four new Pixel models to choose from.The smallest Pixel will come in regular and Pro versions: the Pixel 9 and Pixel…
Will the Pixel 9 get a price hike this year? Read More »
Samsung is announcing today that it has begun mass production of 12 GB and 16 GB LPDDR5X modules in the industry’s thinnest package. Samsung’s shrunken memory packages measure approximately 0.65 mm in thickness, making them 0.06 mm (~9%) thinner than standard LPDDR5X packages. The company expects the new DRAM devices to be used to make…
Samsung Shrinks LPDDR5X Chips by 9%, Now Just 0.65mm Thick Read More »
