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Qualcomm Adds Snapdragon 7s Gen 3: Mid-Tier Snapdragon Gets Cortex-A720 Treatment

Qualcomm this morning is taking the wraps off of a new smartphone SoC for the mid-range market, the Snapdragon 7s Gen 3. The second of Qualcomm’s down-market ‘S’ tier Snapdragon 7 parts, the 7s series is functionally the entry-level tier for the Snapdragon 7 family – and really, most Qualcomm-powered handsets in North America. With…

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Last-minute leak may reveal iPhone 16 Pro prices

I told you recently that the absence of iPhone 16 price leaks is good news for buyers. Unlike the previous two iPhone cycles, there haven’t been any reports to suggest Apple would increase prices across the board. The iPhone 16 Pro is the only exception, as some reports said this model might get the same…

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Rumors of a crazy $2,000 ChatGPT plan could mean GPT-5 is coming soon

There’s been a lot of talk lately that the major GPT-5 upgrade, or whatever OpenAI ends up calling it, is coming to ChatGPT soon. As you’ll see below, a Samsung exec might have used the GPT-5 moniker in a presentation earlier this week, even though OpenAI has yet to make this designator official. The point…

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Samsung’s ultra-slim Galaxy Z Fold 6 SE design might have leaked

The Galaxy Z Fold 6 is thinner and lighter than the previous model from the Korean phone maker, but Samsung wasn’t quite able to match last year’s Honor Magic V2. That foldable featured a 9.9mm profile, while the Fold 6 only shrank to 12.1mm.Things are getting even worse for Samsung, with Honor bad-mouthing the Fold…

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U.S. Signs $1.5B in CHIPS Act Agreements With Amkor and SKhynix for Chip Packaging Plants

Under the CHIPS & Science Act, the U.S. government provided tens of billions of dollars in grants and loans to the world’s leading maker of chips, such as Intel, Samsung, and TSMC, which will significantly expand the country’s semiconductor production industry in the coming years. However, most chips are typically tested, assembled, and packaged in…

U.S. Signs $1.5B in CHIPS Act Agreements With Amkor and SKhynix for Chip Packaging Plants Read More »

Galaxy S25 Ultra leak tells us Samsung might have fixed the worst thing about the Note design

We’re entering Galaxy S25 rumors season now that the Galaxy Z Fold 6 and Flip 6 are out in stores. The next Samsung flagships are likely going to launch in early 2025, and the Ultra will be the best and most expensive version.It makes even more sense to see an uptick in Galaxy S25 rumors…

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The Pixel 9 is Google’s best weapon against Apple Intelligence

Imagine being in the same room as Google’s high-ranking Android execs discussing Apple’s WWDC announcements. Maybe they were following the live stream online to see what Apple Intelligence is all about and how it threatens Gemini.I bet Googlers were thrilled to see and hear that Apple Intelligence would not match the abilities of Gemini and…

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Rapidus Wants to Offer Fully Automated Packaging for 2nm Fab to Cut Chip Lead Times

One of the core challenges that Rapidus will face when it kicks off volume production of chips on its 2nm-class process technology in 2027 is lining up customers. With Intel, Samsung, and TSMC all slated to offer their own 2nm-class nodes by that time, Rapidus will need some kind of advantage to attract customers away…

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Western Digital Teases 128 TB Enterprise SSD: BiCS8 3D QLC for AI Workloads

A week after Western Digital confirmed that it had begun sampling of its 64 TB SSDs for datacenters, the company has teased its next-generation product, a 128 TB solid-state drive at FMS 2024. For now, all we know about Western Digital’s 128 TB SSD is that it uses the company’s BiCS8 QLC NAND memory and…

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