Technology changes fast and tech jobs are changing just as rapidly, according to Belinda Finch, CIO at enterprise technology company IFS. Finch joined IFS late last year from mobile company Three, where she led Three’s digital transformation and helped to drive system developments to support customer experience as CIO. She has also held senior leadership…
CIO interview: Belinda Finch, CIO, IFS Read More »
The UK and South Korean governments have secured voluntary commitments from 16 global artificial intelligence (AI) companies to safely develop the technology, including firms from the US, China and UAE. Signed during the first day of the AI Seoul Summit, the Frontier AI Safety Commitments said the companies will not develop or deploy AI systems…
AI Seoul Summit: 16 AI firms make voluntary safety commitments Read More »
At its European Technology Symposium last week TSMC revealed some of the details about its Global Gigafab Manufacturing program, the company’s strategy to replicate its manufacturing processes across its multiple gigafab sites. The need for large-scale multi-national fabs to have a process in place to replicate their facilities is well-documented at this point. As scaling-up…
TSMC Offers a Peek at ‘Global Gigafab’ Process Replication Program Read More »
Customer demand for AI and HPC processors is driving a much greater use of advanced packaging technologies, particularly TSMC’s chip-on-wafer-on-substrate (CoWoS) services. As things stand, TSMC is just barely meeting the current demand for this packaging method – never mind future demand – which is why last year the company announced plans to more than double CoWoS…
TSMC to Expand CoWoS Capacity by 60% Yearly Through 2026 Read More »
Smartphone vendors have struggled in recent years, with one notable exception: Apple. While others saw sales and profits dive amid economic uncertainty, Apple did something unexpected by selling more expensive iPhones without increasing the price.Apple increased the average selling price for the iPhone, taking advantage of the growing popularity of Pro versions of phones like…
What if Apple slashed iPhone 15 prices globally instead of just in China? Read More »
The Department for Science, Innovation and Technology (DSIT) is reinforcing its commitment to the UK government’s £1bn Semiconductor Strategy by setting out plans to open an independent institute tasked with promoting the sector to overseas investors. The UK Semiconductor Institute will be independently run from the UK government, DSIT confirmed, and bring together commercial entities, private…
DSIT unveils plans for independent institute to underpin UK Semiconductor Strategy Read More »
Although TSMC can’t claim to be the first fab to use extreme UV (EUV) lithography – that title goes to Samsung – they do get to claim to be the largest. As a result, the company has developed significant experience with EUV over the years, allowing TSMC to refine how they use EUV tooling to…
TSMC Outlines Path to EUV Success: More Tools, More Wafers, & Best Pellicles In Industry Read More »
In the contemporary landscape of corporate responsibility, environmental sustainability has become a vital concern. With enterprises facing increasing regulatory pressure to record and mitigate their carbon emissions, energy usage, and overall sustainability practices, CIOs and IT departments find themselves at the forefront of this paradigm shift. As stewards of digital infrastructure and data management, CIOs…
An interim artificial intelligence (AI) safety report has highlighted the lack of universal agreement among AI experts on a range of topics, including both the state of current AI capabilities and how these could evolve over time. The International scientific report on the safety of advanced AI was among the key commitments to emerge from…
Report highlights disagreement among experts on AI safety Read More »
Of the several major changes coming with HBM4 memory, one of the most immediate is the sheer width of the memory interface. With the fourth-generation memory standard moving from an already wide 1024-bit interface to a ultra-wide 2048-bit interface, HBM4 memory stacks won’t be business as usual; chip manufacturers are going to need to adopt…
TSMC Readies Next-Gen HBM4 Base Dies, Built on 12nm and 5nm Nodes Read More »
