Seagate Technology has reportedly notified its customers abouts its plans to raise prices on new hard drive orders and for demands that exceed prior agreements, echoing a similar move by Western Digital, which increased its prices earlier this month. These changes come in response to a surge in demand for high-capacity HDDs and constraints in…
Report: Seagate, Western Digital Hike HDD Prices Amid Surge In Demand Read More »
Taiwan Semiconductor Manufacturing Co. provided several important updates about its upcoming process technologies at its North American Technology Symposium 2024. At a high level, TSMC’s 2 nm plans remain largely unchanged: the company is on track to start volume production of chips on it’s first-generation GAAFET N2 node in the second half of 2025, and N2P…
TSMC 2nm Update: N2 In 2025, N2P Loses Backside Power, and NanoFlex Brings Optimal Cells Read More »
While the bulk of attention on TSMC is aimed at its leading-edge nodes, such as N3E and N2, loads of chips will continue to be made using more mature and proven process technologies for years to come. Which is why TSMC has continued to refine its existing nodes, including its current-generation 5nm-class offerings. To that…
TSMC Preps Cheaper 4nm N4C Process For 2025, Aiming For 8.5% Cost Reduction Read More »
TSMC has been offering its System-on-Wafer integration technology, InFO-SoW, since 2020. For now, only Cerebras and Tesla have developed wafer scale processor designs using it, as while they have fantastic performance and power efficiency, wafer-scale processors are extremely complex to develop and produce. But TSMC believes that not only will wafer-scale designs ramp up in…
TSMC’s System-on-Wafer Platform Goes 3D: CoW-SoW Stacks Up the Chips Read More »
Optical connectivity – and especially silicon photonics – is expected to become a crucial technology to enable connectivity for next-generation datacenters, particularly those designed HPC applications. With ever-increasing bandwidth requirements needed to keep up with (and keep scaling out) system performance, copper signaling alone won’t be enough to keep up. To that end, several companies are developing…
TSMC is no stranger to building big chips. Besides the ~800mm2 reticle limit of their normal logic processes, the company already produces even larger chips by fitting multiple dies on to a single silicon interposer, using their chip-on-wafer-on-substrate (CoWoS) technology. But even with current-gen CoWoS allowing for interposers up to 3.3x TSMC’s reticle limit, TSMC…
Proposed anti-fraud powers will allow the Department of Work and Pensions to monitor the bank accounts of landlords, parents, carers and partners of people receiving state benefits including the state pension. The Data Protection and Digital Information Bill (DPIB), currently going through Parliament, gives the DWP powers to monitor all bank accounts that are “connected”…
Social media company Meta has come under fire as European police chiefs step up pressure against governments and tech companies over the use of end-to-end encryption to secure email and messaging services. Police chiefs from 32 countries, including the UK, said in a declaration published on 21 April that tech companies were rolling out end-to-end…
Many organisations poised to migrate from Oracle Java SE will wonder how long the process will take. There isn’t a one-size-fits-all answer to that question, though. The time needed for a migration depends on at least half a dozen variables that are specific to an organisation. One of those variables is a firm’s migration goals…
Tips for migrating to OpenJDK Read More »
The Department of Science, Technology and Innovation (DSIT) has introduced a pilot scheme called the AI and Digital Hub, which links up AI and digital innovators and regulators. Backed by almost £2m in government funding, the government hopes to use the initiative to provide AI and digital innovators with access to informal advice to help…
Government provides funding to help innovators navigate regs Read More »
