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ASUS NUC14RVHv7 and ASRock Industrial NUC BOX-155H Review: Meteor Lake Brings Accelerated AI to UCFF PCs

Intel’s Meteor Lake series of processors has had a drawn-out launch since its details were officially revealed in September 2023. The series marks Intel’s foray into the consumer market with a tile-based chiplet configuration held together with Foveros packaging. Similar to Tiger Lake, the focus of Meteor Lake has primarily been on the mobile market…

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AI Seoul Summit: 16 AI firms make voluntary safety commitments

The UK and South Korean governments have secured voluntary commitments from 16 global artificial intelligence (AI) companies to safely develop the technology, including firms from the US, China and UAE. Signed during the first day of the AI Seoul Summit, the Frontier AI Safety Commitments said the companies will not develop or deploy AI systems…

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3 exciting Galaxy Z Fold 6 rumors that foldable fans will love

With May almost over, we’re getting very close to Samsung foldable season. Rumors say the Korean tech company will unveil at least three new Galaxy Z devices this summer, with two dropping as soon as July. Samsung reportedly wants its Galaxy Z Fold 6 (Ultra?) and Z Flip 6 out in stores in time for…

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iPhone 16 Pro colors just leaked, and there’s nothing ‘pro’ about them

Each year, iPhone rumor season reveals new color choices long before Apple is ready to unveil its next-gen smartphones. The same goes for the iPhone 16, whose colors already appeared in various leaks.It’s now time for well-known Apple insider Ming-Chi Kuo to chime in. He detailed his predictions in a new post on X, with…

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Microsoft goes all-in on AI hardware with Copilot Plus PCs

During an AI-focused event at the company’s headquarters on Monday, Microsoft announced a new line of laptops called Copilot Plus PCs. In addition to introducing two of its own Copilot Plus PCs, Microsoft CEO Satya Nadella confirmed that its partners Acer, Asus, Dell, HP, Lenovo, and Samsung are all working on their own laptops with…

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TSMC Outlines Path to EUV Success: More Tools, More Wafers, & Best Pellicles In Industry

Although TSMC can’t claim to be the first fab to use extreme UV (EUV) lithography – that title goes to Samsung – they do get to claim to be the largest. As a result, the company has developed significant experience with EUV over the years, allowing TSMC to refine how they use EUV tooling to…

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TSMC Readies Next-Gen HBM4 Base Dies, Built on 12nm and 5nm Nodes

Of the several major changes coming with HBM4 memory, one of the most immediate is the sheer width of the memory interface. With the fourth-generation memory standard moving from an already wide 1024-bit interface to a ultra-wide 2048-bit interface, HBM4 memory stacks won’t be business as usual; chip manufacturers are going to need to adopt…

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Apple and Google finally announced unwanted tracking alerts for more than just AirTags

AirTags have been in the wild since 2021, and Apple and Google have been saying that they plan to enable notifications for unwanted trackers that are, well, tracking you, regardless of the brand that the item tracker comes from. Finally, the companies have announced that they are rolling this capability out.In a press release, Apple…

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Currys signs up Microsoft and Accenture to modernise IT

Currys has chosen Microsoft and Accenture to enable it to develop core cloud technology infrastructure to support artificial intelligence (AI)-powered initiatives. The electronics retailer plans to use the latest AI technologies to enhance operations, elevate the shopping experience and improve the experience of its retail workforce. Through the contract, Accenture and Microsoft, together with their…

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Over 5.3 billion data records exposed in April 2024

Over 5.3 billion data records are known to have bene breached in a total of 652 publicly disclosed cyber security incidents in April 2024, a staggering increase of over 122,000% on April 2023, and over 1,600% higher than in March 2024, according to figures revealed by risk and privacy management specialist IT Governance. Taken with…

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