Micron Introduces 128 GB DDR5-8000 RDIMMs with Monolithic 32 Gb Die
The path to high-capacity RDIMMs for servers has primarily been through 3D stacking (3DS) of DRAM dies using Through-Silicon Vias (TSVs). However, this has presented significant challenges in packaging (driving up the cost), and has also not been efficient in terms of energy consumption. The demand for large memory capacity RDIMMs is being primarily driven…
Micron Introduces 128 GB DDR5-8000 RDIMMs with Monolithic 32 Gb Die Read More »