IPS

Amkor to Build $2 Billion Chip Packaging Fab in Arizona Primarily for Apple

4 minutes of reading / Apple, iPhone, IPS, MacBook, Tech / By

Amkor, the world’s second largest independent outsourced semiconductor assembly and test (OSAT) service provider, has announced their intention to build a new advanced chip packaging facility in the U.S. Carrying a price tag of around 2 billion dollars, the plant in Arizona will primarily serve to package chips produced by TSMC at its Fab 21…

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GlobalFoundries Applies for CHIPS Money to Expand U.S. Fabs

2 minutes of reading / IPS, Tech / By

Update 9/30: Correcting the number of companies interested in receiving support from the CHIPS fund.GlobalFoundries has applied for financial support from the U.S. CHIPS and Science Act to expand its American manufacturing sites, the company said this week. The company intends to get federal grants and investment tax credits to upgrade facilities used to build chips for various…

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