Broadcom

TSMC’s 3D Stacked SoIC Packaging Making Quick Progress, Eyeing Ultra-Dense 3μm Pitch In 2027

TSMC’s 3D-stacked system-on-integrated chips (SoIC) advanced packaging technologies is set to evolve rapidly. In a presentation at the company’s recent technology symposium, TSMC outlined a roadmap that will take the technology from a current bump pitch of 9μm all the way down to a 3μm pitch by 2027, stacking together combinations of A16 and N2…

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Nutanix ramps up VMware opportunity

In his keynote presentation at Nutanix Next 2024 in Barcelona, Nutanix CEO Rajiv Ramaswami discussed the “elephant in the room”, which is the fact that Broadcom’s acquisition of VMware has created what he describes as “a major change and new vendor reality”. Since completing the acquisition of VMware, Broadcom has made major changes to its…

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Broadcom/VMware: Joining the dots to migrate off VMware

This week, there have been a few product announcements that illustrate the opportunity some IT firms see in targeting existing VMware users who are not happy with how the product is changing under Broadcom. The acquisition of VMware by Broadcom completed at the end of 2023. Broadcom has a strategy to move companies from perpetual…

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Ultra Ethernet Consortium Grows to 55 Members, Reveals Some Details on Upcoming HPC Backbone Tech

The Ultra Ethernet Consortium (UEC) has announced this week that the next-generation interconnection consortium has grown to 55 members. And as the group works towards developing the initial version of their ultra-fast Ethernet standard, they have released some of the first technical details on the upcoming standard. Formed in the summer of 2023, the UEC aims…

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Wi-Fi Alliance Introduces Wi-Fi CERTIFIED 7: 802.11be Prepares for Draft Standard Exit

The final approval of the 802.11be standard may only be scheduled for December 2024, but that has not put a spanner in the works of the Wi-Fi Alliance in creating a Wi-Fi 7 certification program. At the 2024 CES, the program was officially announced with products based on silicon from Broadcom, Intel, Mediatek, and Qualcomm…

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The AMD Advancing AI & Instinct MI300 Launch Live Blog (Starts at 10am PT/18:00 UTC)

This morning is an important one for AMD – perhaps the most important of the year. After almost a year and a half of build-up, and even longer for actual development, AMD is launching their next generation GPU/APU/AI accelerator family, the Instinct MI300 series. Based on AMD’s new CDNA 3 architecture, and combining it with…

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