Intel to Reveal Process and Packaging Technology Roadmap During July 26 Webcast
Intel today announced that CEO Pat Gelsinger and Technology Department head Dr. Ann Kelleher would discuss upcoming “process and packaging innovations” on July 26. Gelsinger and Kelleher “will provide a deeper look at Intel’s process and packaging roadmaps” as part of the IDM 2.0 strategy revealed in March. IDM 2.0 will see Intel expand its…
