Veteran TSMC R&D Exec Joins Samsung’s Chip Packaging Team
A high-ranking R&D executive with nearly two decades of experience at TSMC recently took up a position with Samsung. Semiconductor industry insiders speaking with Taiwan’s DigiTimes described the senior executive’s move as “rare” and one that may be a “threat” to TSMC’s hegemony. Lin Jun-Cheng started his long tenure at TSMC in 1999 after serving…
