TSMC Adds Advanced Packaging Capacity to Meet Nvidia Demands: Report
Artificial intelligence (AI), high-performance computing (HPC), and PCs have been driving demand for advanced process technologies rapidly in recent years, and leading chipmakers have expanded their leading-edge production capacities to accommodate them. Apparently, demand for advanced compute GPUs, such as Nvidia’s A100 and H100, is so high that TSMC is now planning to expand its…