Scientists Claim New 3D Resin Print Process Is 30X Faster

Scientists Claim New 3D Resin Print Process Is 30X Faster

Scientists at the École polytechnique fédérale de Lausanne (EPFL) in Switzerland have demonstrated an impressively speedy new 3D printing technology. The demo used photocurable resin and targeted intersecting light beams to solidify precisely chosen areas of resin. In their tests, the scientists found they could produce a sample figurine 30x faster than conventional additive 3D…

TSMC to Start Risk Production Using 4nm Node in Q3

TSMC to Initiate 1.4nm Process Technology R&D

At processor manufacturers, fundamental and applied research and development work never stops, so now that Taiwan Semiconductor Manufacturing Co. has outlined a timeline for its N2 (2 nm-class) fabrication process that will enter high-volume manufacturing (HVM) in 2025, it is time for the company to start thinking about a succeeding node. If a new rumor…

How To Kill a Process in Linux

How To Kill a Process in Linux

In this how-to we’ll look at various ways of using the terminal emulator to identify processes and how to kill them. A process can be an application or script running on your Linux machine. Sometimes a process can crash or become a memory hog and this is when we need to step in and “kill”…

Intel Can Regain Process Tech Lead by 2025, Says IC Knowledge President

Intel Can Regain Process Tech Lead by 2025, Says IC Knowledge President

Intel is currently executing its plans for the successful development of five nodes across four years in an aggressive roadmap leading into measurement in Angstrom  is sometimes referred to as “Intel Accelerated.”  Scotten Jones, president and owner of the semiconductor consulting company IC Knowledge, was initially skeptical about the ambitious semiconductor schedule, but his head…

Intel Process Roadmap Through 2025: Renamed Process Nodes, Angstrom Era Begins

Intel Process Roadmap Through 2025: Renamed Process Nodes, Angstrom Era Begins

Intel CEO Pat Gelsinger whipped the covers off the company’s new process and packaging roadmap that now stretches out to 2025, outlining an annual cadence of the company’s future process nodes spanning from standard nanometer-scale tech down to incredibly small angstrom-class transistors. Intel also teased the first details of its angstrom-class (the next measurement below…