China is neither the world’s largest developer of chips nor the world’s largest maker of semiconductors. However, its swiftly-developing microelectronics industry seems to be generating patent applications at a rapid pace. Last year, Chinese companies filed over half of all semiconductor-related patents globally, according to a report from Mathys & Squire, an intellectual property law firm. “Global powers…
Cincoze Industrial Panel PCs — The Ideal HMI for Smart Manufacturing Tullahoma News and Guardian Source link
“Using a computer to ‘concurrently update’ the map and the list may speed up the process, but ‘mere automation of manual processes using generic computers does not constitute a patentable improvement in computer technology.’” – Federal Circuit The U.S. Court of Appeals for the Federal Circuit (CAFC) today issued a precedential decision finding that two…
The United States International Trade Commission will investigate claims that Realtek and TCL infringed on AMD’s copyright. AMD is one of the premier companies in the tech world, developing processors, graphics cards, and other computer components. With a lot of competition in that field, the company is always keeping a close eye on the others…
AMD has filed a patent for a program that performs automatic memory overclocking to simplify enthusiasts’ lives. The app can automatically test overclocked memory modules for stability and locally store memory overclocking profiles unique to a particular system. Dynamic Random Access Memory (DRAM) overclocking has existed for decades. At first, companies like Corsair cherry-picked memory…
Introduction Few areas of patent law have received as much recent judicial attention in Australia as the statutory test for patentable subject matter. The decision of the Full Court of the Federal Court of Australia in Commissioner of Patents v Aristocrat Technologies Australia Pty Ltd (“Aristocrat”)3 has established a new test for determining whether a computer-implemented invention involves…
Semiconductor companies have been exploring ways to step out of the traditional monolithic GPU die design for a while now, searching for something that will enable better performance scaling while keeping production costs at a sane level. Nvidia’s latest approach to driving things forward is the introduction of 3D die stacking using through-silicon via (TSV)…
