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TSMC Outlines 3nm Roadmap: Five FinFlex Nodes

As pathfinding, research, and development cycle for all-new manufacturing technologies stretches, foundries have to introduce revamped versions of their nodes in a bid to meet client requirements. TSMC on Thursday formally unveiled its N3 (3nm class) family of fabrication processes that will be used to build leading-edge chips in the next three years. One of…