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TSMC Outlines 3nm Roadmap: Five FinFlex Nodes

As pathfinding, research, and development cycle for all-new manufacturing technologies stretches, foundries have to introduce revamped versions of their nodes in a bid to meet client requirements. TSMC on Thursday formally unveiled its N3 (3nm class) family of fabrication processes that will be used to build leading-edge chips in the next three years. One of…

Intel Process Roadmap Through 2025: Renamed Process Nodes, Angstrom Era Begins

Intel Process Roadmap Through 2025: Renamed Process Nodes, Angstrom Era Begins

Intel CEO Pat Gelsinger whipped the covers off the company’s new process and packaging roadmap that now stretches out to 2025, outlining an annual cadence of the company’s future process nodes spanning from standard nanometer-scale tech down to incredibly small angstrom-class transistors. Intel also teased the first details of its angstrom-class (the next measurement below…