Micron Announces 232-Layer 3D NAND Flash

Micron Announces 232-Layer 3D NAND Flash

Micron on Thursday announced the industry’s first 3D NAND memory device featuring 232 layers. The company plans to use its new 232-layer 3D NAND products for a variety of products, including solid-state drives and plans to start ramping up production of such chips sometimes in late 2022.  Micron’s 232-layer 3D NAND device features a 3D…

Crossover Flash Memory Device Standard Announced

Crossover Flash Memory Device Standard Announced

JEDEC has introduced its new Crossover Flash Memory (XFM) form-factor for NAND memory-based storage devices that brings together a small, thin form factor which is easily replaceable while using industry-standard interfaces and protocols. XFM Embedded and Removable Memory Devices (XFMDs) are designed for a wide variety of applications that span from small form-factor Internet-of-Things products…