TSMC Clarifies Apple’s UltraFusion Chip-to-Chip Interconnect
TSMC recently confirmed that Apple used its InFO_LI packaging method to build its M1 Ultra processor and enable its UltraFusion chip-to-chip interconnect. Apple is one of the first companies to use InFO_LI technology. When Apple introduced its 20-core M1 Ultra processor earlier this year, it impressed observers with its UltraFusion 2.5 TB/s inter-processor interconnect and made…