TSMC 2023 Technology Symposium

Pumped Up Procs: TSMC Planning Chips 3x Bigger Than Today

TSMC is developing a new version of its Chip-On-Wafer-On-Substrate-L (CoWoS-L) that will enable it to build extremely large interposers — which it calls Super Carrier Interposers — that pushing the boundaries of current system-in-package (SiPs) sizes to levels never seen before. The next-generation CoWoS technology, planned to be qualified in 2025, will potentially increase the…

Micron - China

China Bans Micron Chips in Wake of Cybersecurity Review

An official statement published by the Cyberspace Administration of China (CAC) says that operators of critical information infrastructure “should stop purchasing Micron products.” The decree, spotted by Wen-Yee Lee, comes after a network security review of Micron’s products sold in China. Apparently, the Chinese government security review found that “Micron’s products have relatively serious potential…