Micron Announces 232-Layer 3D NAND Flash
Micron on Thursday announced the industry’s first 3D NAND memory device featuring 232 layers. The company plans to use its new 232-layer 3D NAND products for a variety of products, including solid-state drives and plans to start ramping up production of such chips sometimes in late 2022. Micron’s 232-layer 3D NAND device features a 3D…
