TSMC to Start Risk Production Using 4nm Node in Q3

TSMC to Initiate 1.4nm Process Technology R&D

At processor manufacturers, fundamental and applied research and development work never stops, so now that Taiwan Semiconductor Manufacturing Co. has outlined a timeline for its N2 (2 nm-class) fabrication process that will enter high-volume manufacturing (HVM) in 2025, it is time for the company to start thinking about a succeeding node. If a new rumor…